Method for manufacturing fingerprint recognition module, fingerprint recognition module, and display device
US11436856B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2020 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Mar 2, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Embodiments of the present disclosure provide a method for manufacturing a fingerprint recognition method, a fingerprint recognition module, and a display device. The method for manufacturing the fingerprint recognition module includes: providing a backplane; forming a bonding terminal in a bonding area of the backplane; forming a sensing electrode in a fingerprint recognition area of the backplane; forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, where an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane; performing polarization processing on the piezoelectric material layer; and peeling off the insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.