Electronic component and method of manufacturing electronic component
US11437182B2 · kind B2 · utility
1Cited by
1References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 30, 2018 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Sep 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F41/127
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component comprising a coil component having an element body containing ceramic, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil; and a mold resin sealing the coil component. The electronic component further comprises an electrode film in contact with an outer surface of the mold resin; and a connection conductor disposed in the mold resin and electrically connecting the external electrode and the electrode film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.