Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction
US11437307B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2020 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Nov 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1434
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device that includes a first die and a package substrate. The package substrate includes a dielectric layer, a plurality of vias formed in the dielectric layer, a first plurality of interconnects formed on a first metal layer of the package substrate, and a second plurality of interconnects formed on a second metal layer of the package substrate. The device includes a first series of first solder interconnects arranged in a first direction, the first series of first solder interconnects configured to provide a first electrical connection; a second series of first solder interconnects arranged in the first direction, the second series of first solder interconnects configured to provide a second electrical connection; a first series of second solder interconnects arranged in a second direction, the first series of second solder interconnects configured to provide the first electrical connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.