Device thermal management
US11437328B2 · kind B2 · utility
0Cited by
2References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2020 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | May 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagnetic interference (EMI) shield is disposed on the electronic components, and a plurality of EMI gaskets are disposed between the electronic components. Each of the EMI gaskets surrounds a respective one of the plurality of electronic components. An evaporative cooler device embedded within the EMI shield is configured to transfer heat away from at least a portion of the electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.