Using electrical connections that traverse scribe lines to connect devices on a chip
US11437337B2 · kind B2 · utility
0Cited by
22References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2020 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Sep 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/08145
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip or integrated circuit includes a layer that includes a first device and a second device. A scribe line is located between the first device and the second device and separates the first device from the second device. An electrically conductive connection traverses the scribe line and is coupled to the first device and the second device, thus connecting the first and second devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.