Package structure having substrate thermal vent structures for inductor cooling
US11437346B2 · kind B2 · utility
2Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2018 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Jan 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein the inductor is at least partially embedded within the substrate. One or more thermal vent structures extend through at least one of the substrate or a board attached to the substrate. The one or more thermal vent structures provide a thermal pathway for cooling for the inductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.