Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods
US11437548B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 23, 2020 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Nov 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/851
Abstract
Pixelated-LED chips including a plurality of independently electrically accessible active layer portions supported by a plurality of discontinuous substrate portions to form a plurality of pixels, with underfill material of varying composition provided between sidewalls of adjacent pixels. Underfill materials having different reflection, scattering, absorption, filtering, etch-resistance, and/or light refraction properties may be provided in multiple layers. A method for fabricating a pixelated-LED chip includes defining streets through an active layer and portions of a substrate to form active layer portions, thinning an entire upper portion of a substrate to create openings into the streets and form discontinuous substrate portions bounding the streets, and supplying underfill material through the openings into the streets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.