RF devices and methods thereof involving a vertical switched filter bank
US11437696B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 11, 2018 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Jul 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1006
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods for manufacturing a microwave or radio frequency (RF) device include mounting a printed circuit board (PCB) on a flexible PCB having at least one ground plane and a signal terminal. The PCB can include a through-hole the sidewalls of which are coated with a conductive material. The methods can include placing a microwave component within the through-hole. The methods can include disposing a conductive cover on the PCB such that the cover is in electrical contact with the ground plane of the flexible PCB through the conductive material, forming shielding around the microwave component. The flexible PCB can be folded along a respective bend portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.