Patent · US Active

Component carrier and method of manufacturing the same

US11439018B2 · kind B2 · utility

1Cited by
7References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 29, 2020
Grant dateSep 6, 2022
Priority date
Expiry dateDec 29, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/10393
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.