Method for manufacturing water resistant printed circuit board
US11439024B2 · kind B2 · utility
0Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2020 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Jul 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1366
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a water resistant substrate comprises a first step of providing a substrate. The method proceeds with a step of populating at least one component onto the substrate. Next, the method includes a step of cleaning the substrate including the at least one component to form a cleaned substrate. Then, the method proceeds with depositing a multi-layered water resistant coating onto the cleaned substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.