Method for producing an aperture plate
US11440030B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2019 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | May 6, 2039 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61M2207/00
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.