Patent · US Active

Laser machining nozzle for a laser machining device, and laser machining device

US11440135B2 · kind B2 · utility

0Cited by

4References

8Claims

0Family size

Assignee

TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

David Schindhelm · Stuttgart, DE
Christian Greger · Stuttgart, DE
Boris Regaard · Gerlingen, DE

Key dates

Filing date	Oct 26, 2018
Grant date	Sep 13, 2022
Priority date	—
Expiry date	Mar 3, 2039

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/1476
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Described is laser machining nozzles for laser machining devices. The laser machining nozzles includes a body having an inner surface and an outer surface. The inner surface of the laser machining nozzles include at least one subarea. The subarea includes a layer of at least one of the copper oxides CuO and Cu2O. The layer of CuO and/or Cu2O has an absorbing effect for radiation at an observation wavelength between 300 and 1100 nm or between 900 and 1700 nm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.