Thermally conductive molded resin article
US11441011B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2017 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | May 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8581
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a thermally conductive molded resin article that can be inexpensively mass-produced and that exhibits a low thermal resistance value as a result of reducing internal thermal resistance by high filling and reducing interfacial thermal resistance by improving cutting precision. The thermally conductive molded resin article is characterized by comprising a resin and thermally conductive fillers including a first thermally conductive filler and a second thermally conductive filler having a smaller particle size than the first thermally conductive filler. The thermally conductive molded resin article is also characterized in that: the first thermally conductive filler has an aspect ratio of 10 or more and is oriented approximately in the thickness direction of the thermally conductive molded resin article; the resin is a silicone resin, an acrylic rubber, or a fluororubber; and the second thermally conductive filler has a thermal conductivity surpassing 5 W/mK.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.