Solder mask inkjet inks for manufacturing printed circuit boards
US11441046B2 · kind B2 · utility
0Cited by
4References
15Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 10, 2018 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Aug 4, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M7/0081
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method of manufacturing an electronic device includes preparing a solder mask with a radiation curable solder mask inkjet ink containing at least one cationic polymerizable compound and a photoinitiating system, wherein the photoinitiating system includes a specified sulphonium compound and a thioxanthone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.