Nano-porous based thermal enclosure with heat removal
US11441825B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2020 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Jul 19, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system includes a dual plate structure having a porous material disposed between the plates such that the porous material is sealed from ambient at a pressure less than ambient. A cooling device is thermally coupled to a mobile device supported by the structure and actively removes heat from the mobile device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.