Fingerprint identification module, manufacturing method thereof and electronic device
US11442583B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2020 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | May 8, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint identification module, a manufacturing method thereof and an electronic device are disclosed. In the fingerprint identification module, an auxiliary structure is at least partially located on a functional substrate, and a plurality of first driving electrodes are on a side, away from the functional substrate, of the piezoelectric material and the auxiliary structure; each first driving electrode extends along a first direction and exceeds a first edge of the piezoelectric material layer in the first direction; the plurality of first driving electrodes are arranged at intervals along a second direction; the auxiliary structure is at least in contact with the first edge; the auxiliary structure includes a slope portion; and a thickness of the slope portion in a direction perpendicular to the functional substrate gradually decreases in a direction from the first edge to a position away from a center of the piezoelectric material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.