Systems and methods for managing thermal dissipation in multi-stacked dies
US11442667B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2021 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Mar 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06589
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems for managing thermal dissipation in multi-stacked memory dies, and methods and computer-readable storage media related thereto, are provided. The system includes memory dies including memory blocks to store data. A processing component is configured to maintain memory block states for the memory blocks. The memory block states include: an open memory block state allowing write operations, and a closed memory block state preventing write operations. The processing component is further configured to: receive a first write command to store first data, and compute first relative distances between open memory blocks in the open memory block state. The processing component is further configured to: select a set of open memory blocks for a first write operation based on the first relative distances so as to manage thermal dissipation, and initiate the first write operation on the first set of open memory blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.