Sandwich assembly scheme for thin film electrode array and integrated circuits on both sides of printed circuit board (PCB) and method of manufacture
US11444056B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2020 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Jul 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4985
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is a sandwich assembly containing a thin film electrode array for use with high density electrodes. To minimize the volume required by the associated electronics, the electrode array and integrated circuits are sandwiched over a Printed Circuit Board (PCB), which may have other integrated circuits on an opposite side. Among other things, the disclosed apparatus, system, and method improve over previous systems by providing holes and vias that facilitate communication between a custom chip above the PCB and a field-programmable gate array (FPGA) below. The thin film electrode array can be fastened by bucking a pillar of stacked gold or other metal balls to rivet the thin film flex circuit. The system can include a thin film array having embedded wire traces and holes, a PCB having vias aligned with the holes, chips including an analog-to-digital converter (ADC) sandwiching the thin film, and solder connections from the chips through the holes to the vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.