Information handling system with a printed circuit board having an embedded interconnect
US11444400B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2020 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Dec 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/518
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An information handling system includes first and second printed circuit boards (PCBs), and first and second connectors. The first PCB includes a first top surface, a first bottom, and a first plurality of side surfaces extending between the first top and first bottom surfaces. The first connector is embedded within the first PCB, and extends from the first bottom surface toward the first top surface. A first height of the first connector is substantially equal to a first thickness of the first PCB. The second PCB includes a second top surface, a second bottom, and a second plurality of side surfaces extending between the second top and second bottom surfaces. The second connector is embedded within the second PCB, and extends from the second bottom surface toward the second top surface. A second height of the second connector is greater than a second thickness of the second printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.