Ultrasonic sensor
US11445304B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2020 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Sep 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/13
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An ultrasonic sensor includes: an element storage case including a case-side diaphragm having a thickness direction along a directional axis; and an ultrasonic element accommodated in the element storage case and spaced apart from the case-side diaphragm. The ultrasonic element includes an element-side diaphragm having the thickness direction along the directional axis and provided by a thin part of a semiconductor substrate. The semiconductor substrate is arranged to provide a closed space between the case-side diaphragm and the element-side diaphragm. The semiconductor substrate is fixed and supported by the element-storage case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.