Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board
US11445605B2 · kind B2 · utility
0Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2020 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Sep 4, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1355
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.