Molding die and molding method
US11446737B2 · kind B2 · utility
1Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2017 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Nov 25, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2005/103
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The molding die of the invention includes: a first die having a through-hole; a second die inserted into the through-hole and capable of moving relative to the first die; and a first punch and a second punch each insertable into the through-hole. A cavity surrounded by the second die, the first punch, and the second punch to compression-mold a molding object is formed in the through-hole. An undercut molding part is formed in the surface of the second die facing the cavity. The second die is formed so as to be splittable into two or more split bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.