System and method for forming material substrate printer
US11446741B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2020 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Aug 10, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method is disclosed for manufacturing a part via an additive manufacturing process. A solution is used which has a volatile component within which is suspended particles of a powdered material. The solution is heated until it at least one of begins boiling or is about to begin boiling. The heated solution is then deposited at least at one location on a substrate to help form a layer of the part. The volatile component then evaporates, leaving only the particles of powdered material. The particles are then heated to the melting point. The deposition and heating operations are repeated to successively form a plurality of layers for the part. The evaporation of the volatile component helps to cool the part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.