Ultrasonic bonding apparatus and method for ultrasonic bonding using the same
US11446878B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jul 29, 2021 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Jul 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10128
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An ultrasonic bonding apparatus includes a stage having an upper surface on a plane defined by a first direction and a second direction crossing the first direction, a head part spaced apart from the stage in a third direction crossing the first direction and the second direction, a first ultrasonic generator which vibrates in a direction parallel to the first direction, and a second ultrasonic generator which vibrates in a direction parallel to the third direction, where each of the first ultrasonic generator and the second ultrasonic generator may be coupled to the stage or the head part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.