Patent · US Active

Structurally reinforced sensor and method for manufacturing the same

US11448611B2 · kind B2 · utility

0Cited by

79References

20Claims

0Family size

Assignee

MEDTRONIC MINIMED, INC. · US

Inventors

Christina Pai · Santa Clarita, US
Brian P. McGee · Santa Clarita, US
Mohsen Askarinya · Chandler, US
Mary Ellen B. Coe · Colorado Springs, US
Cynthia J. Jones · Palmdale, US
Hsiu-Hsin Chung · Gilbert, US
Nathan Hobbs · Los Angeles, US
Jorge L. Nieto · Los Angeles, US
Anirban Chakraborty · Bengaluru, IN

Key dates

Filing date	Jul 3, 2019
Grant date	Sep 20, 2022
Priority date	—
Expiry date	Jul 4, 2040

Classification

Technology area (CPC G)Physics
CPC primaryG01N27/3272
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Sensors and methods for manufacturing sensors are provided. An exemplary method for manufacturing a sensor includes forming an electrode lead pattern over an insulator base substrate. Further, the method includes forming a structural backing layer over the electrode lead pattern and insulator base substrate. Also, the method includes performing a cutting process to cut through the structural backing layer to form a structural backing over the electrode lead pattern.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.