Interdigital transducers on a piezoelectric thin-film for signal compression
US11451209B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2018 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Jul 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/155
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A piezoelectric thin-film suspended above a carrier substrate. An input interdigital transducer (IDT) having first interdigitated electrodes is disposed at different locations along the horizontal axis and on the first side of the piezoelectric thin-film. Each opposing pair of the first interdigitated electrodes is to selectively transduce a particular frequency range of an input electrical signal that varies in frequency over time into an acoustic wave of a laterally vibrating mode based on a pitch between electrodes of the opposing pair. An output IDT that includes second interdigitated electrodes is disposed at different locations along the horizontal axis and on the second side of the piezoelectric thin-film. Each opposing pair of the second interdigitated electrodes is to convert the acoustic wave transduced by the respective opposing pair of the first interdigitated electrodes into a compressed pulse.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.