Driver
US11452228B2 · kind B2 · utility
0Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2020 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Feb 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K2211/03
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A driver is provided. A driver (1) includes an aluminum substrate (10) to which electronic components (13) are joined, and a resin member (20) that covers the electronic components (13). The resin member (20) has a first resin portion (21) that covers the electronic components (13) and a second resin portion (22) that covers the first resin portion (21). The hardness of the first resin portion (21) is lower than the hardness of the second resin portion (22).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.