Method for enhancing boiling performance of chip surface
US11452239B2 · kind B2 · utility
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3References
10Claims
0Family size
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Key dates
| Filing date | Dec 26, 2017 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Oct 7, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method for enhancing boiling performance of chip surface comprising steps of mounting a heat pipe directly above the surface of the chip, and forming a porous structure for increasing the vaporization core on an upper surface of the heat pipe. Performing an enhancing treatment in boiling of the upper surface of the heat pipe by mounting the heat pipe directly above the chip makes a temperature field of the boiling surface uniform, increases the boiling area and vaporization core, strengthens the boiling heat transfer, and reduces the core temperature of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.