Laminated slot die assembly
US11453026B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 12, 2017 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Jul 12, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C5/027
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A slot die assembly for dispensing a fluid onto an article includes an adapter body, a shim package and a die plate. The adapter body includes an adapter conduit configured to receive a fluid. The shim package includes a plurality of shim plates having a shim conduit disposed in fluid communication with the adapter conduit and configured to receive the fluid from the adapter conduit. The shim package further includes a connecting conduit disposed in fluid communication with the shim conduit, a reservoir disposed in fluid communication with the connecting conduit, and a slot disposed in fluid communication with the reservoir. The slot is configured to dispense the fluid onto an article. The die plate is disposed in abutting relationship to the shim package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.