Heat-shrinkable multilayer film
US11453207B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2017 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Nov 7, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1379
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a heat-shrinkable multilayer film including: an outer surface layer including a thermoplastic resin; an intermediate layer including a polyamide resin; and an inner surface layer including a sealable resin; the total thickness of the heat-shrinkable multilayer film being from 95 to 160 μm; the thickness of the intermediate layer including the polyamide resin being from 17 to 47 μm; the thickness of the inner surface layer being 55 μm or greater; and the ratio of the thickness of the intermediate layer including the polyamide resin to the total thickness of the heat-shrinkable multilayer film being from 18 to 29%. The heat-shrinkable multilayer film of the present invention has high strength and excellent flexibility. Therefore, the heat-shrinkable multilayer film of the present invention is easily stretched and formed, and can be suitably used as a variety of packaging materials including a food packaging material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.