Patterned stamp manufacturing method, patterned stamp imprinting method and imprinted article
US11453232B2 · kind B2 · utility
0Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2018 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Apr 11, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2059/023
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a patterned stamp for patterning a contoured surface is disclosed. The method comprises providing a pliable stamp layer carrying a pattern of features, forcing the pliable stamp layer onto the contoured surface with said pattern of features facing the contoured surface; applying a fluid support layer over the pliable stamp layer on the contoured surface; solidifying the support layer to form the patterned stamp; and removing the patterned stamp from the contoured surface. A corresponding patterned stamp, imprinting method and imprinted article are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.