Thermoset epoxy resin, its preparing composition and making process thereof
US11453743B2 · kind B2 · utility
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2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2020 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Jun 14, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2170/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.