Polyamide moulding compound and its use and mouldings manufactured from the moulding compound
US11453778B2 · kind B2 · utility
1Cited by
37References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2020 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Jan 29, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K7/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to polyamide moulding compounds that contain a semi-crystalline copolyamide, at least one filler, and optionally additives. The invention likewise relates to mouldings manufacture from these moulding compounds and to the use of the moulding compounds to manufacture mouldings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.