Solder mask inkjet inks for manufacturing printed circuit boards
US11453793B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
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Inventors
Key dates
| Filing date | Apr 6, 2021 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Apr 6, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/01
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides an inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board. By using a solder mask inkjet ink containing at least one photoinitiator, at least one free radical polymerizable compound and at least one mercapto functionalized carboxylic acid as adhesion promoter, a high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties, may be produced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.