Heat dissipating fin with thermosiphon
US11454462B2 · kind B2 · utility
0Cited by
7References
23Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 5, 2019 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Mar 20, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2015/0225
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.