Substrate evaluation chip and substrate evaluation device
US11454601B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 20, 2020 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Aug 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A substrate evaluation chip is used to perform a test for evaluating a thermal characteristic of a mounting substrate that is mountable a power semiconductor. The substrate evaluation chip includes an insulating substrate bonded with the mounting substrate, and a heating pattern that is formed on a surface of the insulating substrate by a metallic film and is arranged by having a predetermined shape that is optimized to beat the insulating substrate more uniformly. The insulating substrate is a substrate in which an insulating film is formed on a surface of a single crystal substrate having a thermal conductivity of 250 [W/mK] or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.