Patent · US Active

Cover plate and manufacturing method thereof, electronic device

US11455824B2 · kind B2 · utility

0Cited by

1References

15Claims

0Family size

Assignee

BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD. · CN

Inventors

Dejun Bu · Beijing, CN
Paoming TSAI · Beijing, CN
Jianwei Li · Nanhu, CN

Key dates

Filing date	Oct 23, 2018
Grant date	Sep 27, 2022
Priority date	—
Expiry date	Feb 1, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K5/03
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A cover plate and a manufacturing method thereof, an electronic device are disclosed. The cover plate includes an operation area, the operation area includes an identification area and a non-identification area, the cover plate includes a contact surface, the contact surface includes a first contact surface and a second contact surface, the first contact surface is in the identification area, the second contact surface is in the non-identification area, and the first contact surface and the second contact surface have different contact properties.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.