Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
US11456235B1 · kind B1 · utility
1Cited by
84References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 11, 2021 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Feb 11, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2260/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.