Integrated circuit
US11456262B2 · kind B2 · utility
0Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2020 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Dec 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.