Optoelectronic semiconductor chip

US11456404B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Roland Enzmann · Regensburg, DE
• Lorenzo Zini · Regensburg, DE
• Vanessa Eichinger · Wenzenbach, DE
• Stefan Barthel · Regensburg, DE

Key dates

• Filing date: Oct 25, 2018
• Grant date: Sep 27, 2022
• Expiry date: Jan 27, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8316

Abstract

An optoelectronic semiconductor chip may include a semiconductor body, a first and second contact element, a chip carrier, an electrically conductive contact layer, an electrically conductive supply layer, an insulating layer between the contact layer and the supply layer, and at least one electrically conductive feed-through element embedded in the insulating layer. The feed-through element(s) may electrically connect the supply layer to the contact layer. A quantity and/or size of the feed-through elements may be greater on a second side of the semiconductor body opposite to the first side than on the first side.