Radio-frequency three-dimensional electronic-photonic integrated circuit with integrated antennas and transceivers
US11456523B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2017 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | May 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6694
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radio-frequency three-dimensional electronic-photonic integrated circuit (RF 3D EPIC) comprises a radio-frequency (RF) photonic integrated circuit (PIC) layer, the RF PIC layer comprising, in a single integrated circuit, at least one RF antenna and at least one photonic device coupling the RF antenna to an optical interface, and further comprises an electronic-photonic integrated circuit (EPIC) assembly optically coupled to the optical interface of the RF PIC layer, the EPIC assembly comprising two or more integrated-circuit dies bonded to one another so as to form a die stack, wherein at least one of the two or more integrated-circuit dies comprises one or more integrated photonic devices and wherein each of the two or more integrated-circuit dies is electrically connected to at least one other integrated-circuit die via an electrically conductive through-wafer interconnect or an electrically conductive through-wafer via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.