Metallic housing of electronic device
US11457535B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2020 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Nov 17, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metallic housing of an electronic device including an inner surface, an outer surface and a first non-conductive spacer is provided. The outer surface is opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first gap and the second gap each communicates the inner surface and the outer surface. The first non-conductive spacer is disposed the first gap of the metallic housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.