Conductive transfer
US11457868B2 · kind B2 · utility
1Cited by
2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2020 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | May 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive transfer for application to an article comprises first and second non-conductive layers and a conductive layer positioned between the two non-conductive layers. The conductive transfer further comprises an adhesive layer for adhering the conductive transfer to an article, such as a wearable item. The conductive layer comprises a plurality of tessellated cells defined by a printed conductive ink. The conductive layer comprises a main element and an input track with the plurality of tessellated cells being comprised over the input track of said conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.