Endoscopic full thickness resection device
US11457973B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2019 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Jan 13, 2041 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2018/1475
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present disclosure relates generally to devices and methods for full thickness tissue resection of an organ (e.g., intestine). In some embodiments, a device includes a conduit, and a plurality of arms rotatably coupled to the conduit. Each of the plurality of arms is movable between a collapsed position and an expanded position, wherein the plurality of arms extends radially outward from the conduit in the expanded position. The device may further include an electrocautery wire coupled to each of the plurality of arms, the electrocautery wire positioned directly adjacent an exterior tissue wall when the plurality of arms is in the expanded position. The device may be advanced back in towards a lumen of the organ until a targeted section of tissue is cut by the electrocautery wire and removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.