Hollow polymer particles for thermal insulation
US11459438B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2017 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Feb 3, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0276
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A thermal insulating additive, product formed therefrom, and method of making the same, wherein the thermal insulating additive comprises a plurality of hollow polymeric particles having an average particle size up to about 0.3 micrometers. The hollow polymeric particles exhibit a mechanical strength in a compression test up to about 420 psi and a thermal conductivity that is less than 0.150 W/m-k. The hollow polymeric particles are individually formed as an alkaline swellable core that is at least partially encapsulated with two or more shell layers; the alkaline swellable core prior to swelling exhibits an average particle size that is less than about 50 nanometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.