Patent · US Active

Printed circuit board module

US11460015B2 · kind B2 · utility

0Cited by

1References

13Claims

0Family size

Assignee

ebm-papst St. Georgen GmbH & Co. KG · DE

Inventors

Volker Ehlers · St. Georgen, DE
Ralf-Michael Sander · St. Georgen, DE

Key dates

Filing date	Feb 7, 2020
Grant date	Oct 4, 2022
Priority date	—
Expiry date	Apr 16, 2041

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A printed circuit board module (10) has a printed circuit board (20) with a first side (21), a second side (22) and a contact hole (30). A sleeve-type via (32) is provided in the contact hole 30. An annular ring (35, 36) is associated with the via (32), on at least one side (33, 34). The annular ring (35, 36) is arranged on the first side (21) or on the second side (22) of the printed circuit board (20). The annular ring (35, 36) is electrically connected to the via (32). The annular ring (35, 36) has an annular ring edge (40), at least in sections. The printed circuit board module (10) has a solder resist layer (50). It extends, at least in sections, from outside the annular ring edge (40) over the annular ring edge (40) to an outer region (42) of the annular ring (35, 36). An inner region (44) not covered with the solder resist layer (50), remains on the annular ring (35, 36).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.