LED backlight system and mounting system
US11460173B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2022 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Jan 5, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Rack-type backlight light emitting element (LEE) printed circuit boards (PCBs) with at least two layers to provide redundant current paths. This enables a PCB strip to be broken at designated perforations in the field in order to accommodate pipes or fixtures that require formation of a gap in the rack array. The entire length and width of an array can be sized in the field. A plurality of PCB arrays can be serially chained together with the system. A chain of PCB strips is snapped into clips, which in turn snap into rails that are fastened to a surface. The mounting system includes various types of clips, such as end clips, clips for different LEE patterns on the PCBs, and mounting clips to secure the rails to a surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.