Wafer scale ultrasonic sensor assembly and method for manufacturing the same
US11460341B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 3, 2019 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Aug 4, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1306
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A wafer scale ultrasonic sensor assembly includes a wafer substrate, an ultrasonic element, first and second protective layers, conductive wires, a transmitting material, an ASIC, a conductive bump, and a soldering portion. The wafer substrate includes a via. The ultrasonic element is exposed to the via. The conductive wires are on the first protective layer and connected to the ultrasonic element. The second protective layer covers the conductive wires, and the second protective layer has an opening corresponding to the ultrasonic element. The transmitting material contacts the ultrasonic element. The ASIC is connected to the wafer substrate, so that the via forms a space between the ASIC and the ultrasonic element. The conductive pillar is in a via defined through the ASIC, the wafer substrate, and the first protective layer, and the conducive pillar is respectively connected to the conductive wires and the soldering portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.