Thermal module assembly for a computing expansion card port of an information handling system
US11460895B2 · kind B2 · utility
2Cited by
14References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2020 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Oct 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thermal module assembly, comprising: a computing expansion card; a thermal interface material (TIM) positioned on a surface of the computing expansion card; a thermal plate; and a carrier configured to hold the computing expansion card with the TIM positioned on the surface of the computing expansion card, the carrier include a first end positioned opposite to a second end, wherein the thermal plate is removably coupled to the carrier at the first end and the second end to provide an uniform pressure between the thermal plate, the TIM material, and the computing expansion card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.