Micro OLED display device with sample and hold circuits to reduce bonding pads
US11462176B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2020 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Dec 22, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09G2370/08
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments relate to a display device including bonding pads on a display element where data signals for a plurality of columns of pixels are provided to a same bonding pad in a time-divisional manner. Each of the bonding pads is connected to a plurality of demultiplexer circuits for sampling data signals at the bonding pad, storing the data signals, and transferring the sample data signals to corresponding columns of pixels. Each column of pixels includes a plurality of columns of subpixels, and a period during which a demultiplexer circuit samples the bonding pad for a column of subpixels of a first color may at least partially overlap with a period during which the demultiplexer circuit transfers previously sampled data signals to a column of subpixels of a second color.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.